SiC含量对SiCp/Al复合材料摩擦性能的影响

采用粉末冶金技术制备了SiC_p/Al复合材料,探讨了SiC颗粒质量分数对SiC_p/Al复合材料密度、布氏硬度、微观形貌以及摩擦磨损性能的影响。结果表明,SiC颗粒表面形成了少量可提高界面结合性的Al₄C₃化合物。随着SiC质量分数增加,SiC_p/Al复合材料的密度没有明显的变化,当SiC质量分数增加至25%时,密度明显下降。SiC_p/Al复合材料的布氏硬度随着SiC质量分数的增加呈先增长后减小的变化趋势。当SiC质量分数为20%时,材料的硬度最优（HBW 114）,平均摩擦系数达到最大值（0.3425）,摩擦后试样表面形貌平整且犁沟较浅,SiC颗粒未出现明显剥落。     

In-situ generation of platinum nanoparticles on LaCoO3 matrix for soot oxidation

The LaCo_0.94Pt_0.06O₃ catalyst is reduced under 5% H₂/Ar at different temperatures to get Pt/LaCoO₃ with high catalytic activity for soot oxidation. Transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD), Brunauer–Emmett–Teller method (BET), X-ray photoelectron spectroscopy (XPS), H₂-temperature programmed reduction (H₂-TPR), O₂-temperature programmed desorption (O₂-TPD) and thermogravimetric analysis (TGA) were used to study the physicochemical properties of the catalyst. SEM and TEM results indicate that Pt nanoparticles (<10 nm) are grown homogeneously on the surface of the LaCoO₃ matrix after in-situ reduction. XRD shows that the reduced catalyst has a high symmetrical structure. TGA results indicate that all reduced catalysts exhibit an excellent activity, especially the catalyst reduced at 350 °C (T₁₀ = 338 °C, T₅₀ = 393 °C, T₉₀ = 427 °C). And perovskite is the primary active component. According to XPS study, the high symmetrical structure benefits the mobility of oxygen vacancy, and Pt nanoparticles induce the oxygen vacancy to move to its adjacent situation, resulting in more adsorbed oxygen on the surface of the reduced catalyst and increasing the activity. The possible reaction principle is also proposed.     

超细粉颗粒形貌控制技术的研究

颗粒形貌对颗粒群的许多性质具有重要的影响。本研究以流化床气流磨加工碳化硅磨料微粉为实例，对颗粒形貌控制的基本因素进行理论分析与实验研究，并探讨了超细加工后的整形技术及超细加工前的预处理技术。可获得球形化程度好的等积形颗粒形貌，也可获得较好的多棱形颗粒形貌，这对提高超细粉的工业价值和经济价值，扩大应用领域和范围，具有重要的意义。     

Synthesis of Ti3SiC2 by spark plasma sintering(SPS)of elemental powders

Ti3SiC2 materials have been fabricated by spark plasma sintering of the elemental powders with the addition of Al.At the heating rate of 80℃/min and under the pressure of 30MPa,the ideal synthesis temperature of Ti3SiC2 is in the range of 1150-1250℃.The addition of Al is in favor of the formation of Ti3SiC2.The synthesized compound has the molecular of Ti3Si0.8Al0.2C2 and lattice parameters of α=0.3069nm,c=1.7670nm.Its grain is plane-shape with a size of about 50μm in the elongated dimension.The prepared material has Vickers hardness of 3.5-5.5GPa(at 1N and 15s) and is as readily machinable as graphite‘s.     

Structure and electronic properties of SiC thin-films deposited by RF magnetron sputtering

SiC thin-films were prepared by RF-magnetron sputtering technique(RMS) with the target of single crystalline SiC and then annealed. The surface morphology of thin-films was characterized by AFM. The result shows that the surface of the thin-films is smooth and compact; XRD analysis reveals that the thin-films are amorphous. The thickness, square-resistance and curves of resistance—temperature were measured. The results show that the curves of lnR versus 1/kT both before and after annealing satisfy the expression of lnR∝△W/kT, where ?W is electron excitation energy in the range of 0.014 2-0.018 5 eV, and it has a trend of increasing when the temperature is increased. After synthetical analysis we get the conclusion that the electronic mechanism of the thin-films is short distance transition between the localized states in the temperature range of 25-250 ℃. The resistivity is in the range of 2.4×10-3-4.4×10-3 Ω·cm and it has the same trend as electron excitation energy when annealing temperature is increased, which further confirms the electronic mechanism of thin-films and the trend of electron excitation energy versus annealing temperature.     

SiC(W)/ZrO2(P)协同复合MoSi2陶瓷磨损特性的研究

在无润滑条件下测定了SiC（W）/ZrO2（P）协同复合MoSi2陶瓷的磨损特性曲线,并对其磨损特征进行了分析.结果表明,随着SiC晶须以及ZrO2纳米颗粒含量的提高,MoSi2-SiC（W）/ZrO2（P）复合陶瓷的磨损特性由单纯的磨粒磨损逐渐转变为磨粒磨损和粘着磨损的混合.ZrO2纳米颗粒的加入有利于提高复合陶瓷的韧性,SiC晶须的加入有利于提高复合陶瓷的硬度,复合陶瓷的整体耐磨性主要由硬度和韧性共同决定.SiC（W）/ZrO2（P）协同复合作用使得MoSi2复合陶瓷的耐磨性得以明显改善.     

SiC连续纤维增强Ti基复合材料界面反应扩散研究进展

介绍了目前研究Ti基复合材料界面反应扩散模型、界面反应的动力学和热力学、界面反应扩散控制机理。以及障碍涂层对界面反应扩散的影响。指出SiC纤维增强Ti基复合材料界面反应扩散的研究重点和发展方向。     

SiCp/2024铝基复合材料的超塑性变形行为研究

对经过热处理和冷轧后的体积分数为17％，尺寸为3．5μm的SiC颗粒增强2024铝合金薄板在753－853K范围内进行了超塑性实验研究. 结果在813K时以10^-1/S的变形速率下获得了259％的最大延伸率，最大应力敏感系数为0．25复合材料的变形激活能值在753－793K范围内为144kJ/mol，在813－853K内为202kJ/mol，接近纯铝的晶格扩散激活能值142kJ/mol。复合材料的变形机制主要为基体晶粒滑动机制。     

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

SiC FIBER／ALUMINIUM PREFORM WIRES FABRICATEDBY ULTRASONIC LIQUID INFILTRATION PROCESS

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